发明名称 VACUUM SUCTION APPARATUS
摘要 PURPOSE:To release a suction holding state by disposing and opening a leakage hole communicating slightly with an atmosphere at the suction port side from a first switching valve in a suction passage for supplying negative pressure to a suction port to supply the atmospheric air from the hole to the suction port when the suction holding is released to set the suction port at positive pressure. CONSTITUTION:When a wafer 1 is placed on the suction surface 3 of a suction head 2, a switching valve 9 is opened, negative pressure is supplied to a suction port 5 through a tube 8, the valve 9 and an attraction passage 7, thereby holding the wafer 1 at the head 2. Then, when releasing the suction holding of the wafer, the valve 9 is closed, the supply of negative pressure from a negative pressure source is stopped, the negative pressure of the passage 7 is continuously leaked from a leakage hole 12, and the atmospheric air is relatively fed. Thus, the attraction force of the port 6 is gradually weakened to release the suction. At this time, since the inner diameter of the hole 12 is small, an impact applied to the wafer 1 is weak due to the flow of the atmospheric air. As a result, the wafer 1 is not moved on the suction surface 3.
申请公布号 JPS632345(A) 申请公布日期 1988.01.07
申请号 JP19860144863 申请日期 1986.06.23
申请人 HITACHI LTD 发明人 SHIMIZU MASAYUKI;YAMADA SEIICHI;MIYAZAKI ISAO
分类号 H01L21/683;H01L21/67;H01L21/68 主分类号 H01L21/683
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