| 摘要 |
PURPOSE:To recognize an actual array by simultaneously recognizing a plurality of wafer chips by one visual detection, detecting the positional relationship of a plurality of wafer chips of reference and a pitch between the chips, and moving the recognized position while correcting the recognized position to detect it, thereby eliminating the intermediary of an operator. CONSTITUTION:A wafer ring 14 having aligned wafer chips 11 is secured on an XY table 15, the chips 11 are picked up by an ITV camera 1, the image is processed by the picked image signal by means of a recognition unit 2, the result is transferred by a communication channel 3 to a die bonder controller 4 to control the table 15 to the recognition position and pickup position of the chips 11. Four wafer chips are simultaneously recognized at the recognition position initially given by an operator, the table 15 is moved by the pickup unit of the chips from the recognition result, the chips are mounted, next recognition position is then calculated including a pitch correction, the table 15 is moved, and similarly recognized. These operations are repeated to mount the chips. |
