发明名称 PHOTOSENSITIVE COMPOSITION
摘要 A photosensitive composition of this invention comprises: (a) a photosensitive diazo resin represented by the following general formula (I): <IMAGE> (I) wherein R1, R2 and R3 each represents a hydrogen atom, an alkyl or alkoxy group, R represents a hydrogen atom, an alkyl or phenyl group, X represents PF6 or BF4 and n represents a number of 1 to 200, in which a resin with the number n in the above formula being 5 or more is contained by more than 20 mol %, (b) an oleophilic high molecular weight compound with hydroxyl group and (c) a high molecular weight organic acid without hydroxyl group, and in which the content of the ingredient (c) is from 1.5 to 30% by weight based on the solid matter in said composition. The photosensitive composition of this invention can provide a photosensitive layer having high sensitivity and being excellent in storage stability and developability as well as excellent in the film strength.
申请公布号 EP0177962(A3) 申请公布日期 1988.01.07
申请号 EP19850112867 申请日期 1985.10.10
申请人 MITSUBISHI CHEMICAL INDUSTRIES LIMITED;KONISHIROKU PHOTO INDUSTRY CO. LTD. 发明人 TOMIYASU, HIROSHI;MAEDA, YOSHIHIRO;GOTO, KIYOSHI;SUZUKI, NORIHITO
分类号 G03F7/016;G03C1/52;G03C1/54;G03C1/60;G03F7/004;G03F7/021;G03F7/033;G03F7/038 主分类号 G03F7/016
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