发明名称 |
Method for producing electrical connections inside semiconductor components and electrical connection for semiconductor components |
摘要 |
Due to the fact that in a semiconductor component, bonding first occurs to contact areas outside the semiconductor chip and only then at the semiconductor chip, considerable advantages are produced with respect to alignment accuracy, less risk of short circuits and simpler test and repair possibilities. <IMAGE>
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申请公布号 |
DE3621917(A1) |
申请公布日期 |
1988.01.07 |
申请号 |
DE19863621917 |
申请日期 |
1986.06.30 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
SEIPLER,DIETER,DIPL.-PHYS.DR. |
分类号 |
H01L21/60;(IPC1-7):H01L21/607 |
主分类号 |
H01L21/60 |
代理机构 |
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主权项 |
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地址 |
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