发明名称 HEATSINK STRUCTURE
摘要 An heat sink (10) is disclosed in which a plurality of heat conducting fins (20) extends from a base of heat conductive material. The top surface (14) of the base is peaked to reduce the dead space that would otherwise occur during vertical impingement air flow. In the preferred embodiment, the top surface is pyramidal in shape with the peak (18) at the center. In other embodiments, the top surface can be convex or concave and have the peak located off center. Also webs of material can be left at the bottom of the cooling fins to provide channels for improved air flow.
申请公布号 JPS632357(A) 申请公布日期 1988.01.07
申请号 JP19870091091 申请日期 1987.04.15
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 AREN JIYOSEFU AANORUDO;KERII RUISU SATSUTON
分类号 H01L23/36;H01L23/367;H01L23/467 主分类号 H01L23/36
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