发明名称 |
Assembly for handling flexible film substrates. |
摘要 |
<p>An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like.</p> |
申请公布号 |
EP0250736(A2) |
申请公布日期 |
1988.01.07 |
申请号 |
EP19870105379 |
申请日期 |
1987.04.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CLEMENTI, ROBERT JOSEPH;GAZDIK, CHARLES EDWARD;LAFER, WILLIAM;LOVESKY, ROY LEWIS;MCBRIDE, DONALD GENE;MUNSON, JOEL VERN;SKARVINKO, EUGENE PETER |
分类号 |
H01L21/60;H01L21/48;H01L23/498;H01L23/538;H05K1/00;H05K3/00;H05K3/38 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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