| 摘要 |
PURPOSE:To improve the bondability of both a pad formed on a semiconductor chip and inner leads and the moisture resistance thereof by intermittently forming contracted parts of cross sections by slits, waveforms, or cutouts at tab hanging leads to increase a resistance with respect to moisture at the contracted parts, and enlarging the part integral with the sealer. CONSTITUTION:Three slits 5 are formed at tab hanging leads 4. Since the slits are formed at a predetermined interval, cross sectional contracted parts ate intermittently formed at the leads 4. The pads formed at a semiconductor chip 3 are bonded to inner leads 7 by Au wirings or aluminum wirings to form an IC 1. Since the moisture transmitting route is reduced at the contracted part, it increases a resistance against moisture, thereby reducing the invasion of moisture. A sealer 6 is strengthened in its integration through the leads 4. Since the slits 5 are intermittently formed, the whole leads 4 have elasticity. Even if thermal stress is applied to the leads 4, they can absorb it.
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