| 发明名称 |
Seeding process for electroless metal deposition. |
| 摘要 |
<p>A process for depositing and tightly binding noble metal seeds onto a substrate by coating the substrate with a very thin layer of a polymer which complexes with a noble metal compound and contacting the layer of polymer with a noble metal compound which forms a complex with the layer of polymer.</p> |
| 申请公布号 |
EP0250867(A1) |
申请公布日期 |
1988.01.07 |
| 申请号 |
EP19870107667 |
申请日期 |
1987.05.26 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JACKSON, ROBERT LLOYD |
| 分类号 |
C23C18/16;C23C18/30;H05K3/18;(IPC1-7):C23C18/30 |
主分类号 |
C23C18/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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