发明名称 |
Insulating resin composition and semiconductor device using the same. |
摘要 |
<p>Insulating resin composition for a semiconductor device having a multilevell interconnection layers formed by the resin and having a superior planarizing capability relative to a lower interconnection layer is provided, which resin being a cured product of a polyamic acid ester oligomer obtained by reacting an aromatic diamine and/or a diaminosiloxane with an aromatic tetracarboxylic acid ester obtained by reacting an aromatic tetracarboxylic acid dianhydride with an alcohol or alcohol derivative.</p> |
申请公布号 |
EP0251828(A1) |
申请公布日期 |
1988.01.07 |
申请号 |
EP19870305975 |
申请日期 |
1987.07.06 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
SUZUKI, HIROSHI YAMAZAKI WORKS;UCHIMURA, SHUNICHIROÂYAMAZAKI WORKS;SATO, HIDETAKA HITACHI CHEMICAL CO.AMERICA LTD. |
分类号 |
H01L21/31;C08G73/10;H01B3/30;H01L21/312;H01L21/331;H01L21/768;H01L23/522;H01L29/73;H01L29/732 |
主分类号 |
H01L21/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|