发明名称 |
Process for the treatment of copper oxide in the preparation of printed circuit boards |
摘要 |
A composition and process is disclosed for improving the leach resistance of the copper oxide coating on the copper circuitry of printed circuit boards to solutions used in their preparation which comprises contacting the copper oxide of the circuit board with a solution containing an amphoteric element which forms an acidic oxide, such as selenium dioxide.
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申请公布号 |
US4717439(A) |
申请公布日期 |
1988.01.05 |
申请号 |
US19850790999 |
申请日期 |
1985.10.24 |
申请人 |
ENTHONE, INCORPORATED |
发明人 |
HAJDU, JUAN;BAYES, MARTIN W. |
分类号 |
C23C22/63;H05K3/38;H05K3/46;(IPC1-7):H05K1/09;H05K3/22;C23F11/00 |
主分类号 |
C23C22/63 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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