COMPOSITION FOR BONDING ELECTROCONDUCTIVE METAL COATING TO ELECTRICALLY NONCONDUCTIVE MATERIAL

摘要

COMPOSITION FOR BONDING ELECTROCONDUCTIVE METAL COATING TO ELECTRICALLY NONCONDUCTIVE MATERIAL This invention provides a composition comprising about 15 to about 75% by weight of a thermosetting or ultraviolet curable resin, about 24.5 to about 84.5% by weight of finely divided heat-resistant inorganic substance and about 0.5 to about 20% by weight of a finely divided palladium catalyst. This composition is the solvent-free type and useful for forming an electroconductive metal coating on an electrically nonconductive base material by chemical plating.