| 摘要 |
PURPOSE:To attain an alignment method provided with extremely high accuracy and high productivity by measuring a displacement of the whole wafer regarding a displacement of a rotation component to make a correction as a whole, while correcting a displacement of a translation comonent for each shot. CONSTITUTION:A wafer WF which is for actual printing is set on an X-Y stage XYS and prealignment marks PM1 and PM2 are detected by an off-axis microscope OA arranged outside a projection lens, thereby roughly positioning the reticle RT and the wafer WF. Next, accurate positioning of the reticle RT and the wafer WF regarding a rotation component is effected by TTL-THETA- gloval alignment. Furthermore, the X-Y stage XYS is drived in order to position a shot region of the wafer WF as an actual printing position onto a printing projection lens LN. By TTL-x, y die-by-die alignment, the positining regarding the translation component of the reticle RT and the wafer WF is effeted for each shot. |
