发明名称 IMPROVEMENT IN OR RELATING TO PLASTICS ENCAPSULATED ELECTRONIC DEVICES
摘要 The plastic encapsulation material covering an integrated circuit is impregnated with a corrosion inhibitor evenly dispensed throughout the material. This inhibits the corrosion of the metallization on the surface of the integrated circuit thus prolonging the life of the device particularly under adverse environmental conditions.
申请公布号 MY8700287(A) 申请公布日期 1987.12.31
申请号 MY19870000287 申请日期 1987.12.30
申请人 THE PLESSEY COMPANY LIMITED 发明人 JACK BRETTLE;MARTIN TREVOR GOOSEY
分类号 H01G2/12;H01L23/29;H05K3/28;(IPC1-7):H01L23/30 主分类号 H01G2/12
代理机构 代理人
主权项
地址