| 摘要 |
A carrier for an IC package having a plurality of IC leads projecting in parallel sidewise from at least two lateral side surfaces thereof comprises a carrier substrate including a section for accommodating the IC package therein and a plurality of grooves formed in the central surface of the carrier substrate for accommodating therein the IC leads and supporting the lower surfaces of the IC leads on the bottoms thereof when the IC package has been accommodated in the section. Also included is an IC package support detachably mounted at a position on the carrier substrate, disengageably engaged at another position with the carrier substrate and comprising at least two IC lead retaining bars which are disposed so as to engage the upper surfaces of the IC leads for retaining against the lower surfaces of the bars the upper surfaces of the IC leads when the IC package support has been engaged with the carrier substrate having the IC package accommodated in the section thereof.
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