| 摘要 |
Apparatus and method for providing a floating seal for an inert gas solder reflow chamber. The seal floats with respect to upper and lower chucks and is made of a substantially non-deformable material. The seal permits lateral, axial and rotational movement between the lower and upper chucks while facilitating accurate control of bonding pressure. The structure of this floating seal permits use of seal materials which facilitate use of higher melting point solders, some in excess of 350 DEG C., for flip-chip bonding.
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