| 摘要 |
Locator device for locating modular electronic components centrally with respect to a nozzle of an apparatus for attaching the components to a substrate, such as a printed circuit board. The locator device comprises a component support member for supporting a component to be located centrally with respect to the nozzle of a component attachment apparatus, and a component centralizing element associated with the component support member and engageable with the nozzle for centralizing the component with respect to the nozzle prior to soldering of the component to the printed circuit board. When the component has been centralized with respect to the nozzle, the component is maintained in its centralized position by attachment to a source of vacuum disposed within the nozzle. This facilitates removal of the locator device from the nozzle to leave the component disposed centrally within the nozzle attached to the source of vacuum and ready for installation on the printed circuit board.
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