| 摘要 |
PURPOSE:To facilitate a heat treatment by mounting a heating unit on a hot plate formed with traveling slots on the surface for placing a wafer, and inserting movably a moving wire along the longitudinal direction in the slots, thereby telescoping a wire in the slots by an elevator mounted on the plate. CONSTITUTION:Two traveling slots 32 of a moving wire 31 are formed on the surfacse of a hot plate 30 of a wafer feeding unit 40, and a heating unit 33 which contains a heater is provided on the back surface of the plate 30. A hot plate elevator 35 is supported through a heat insulator 34 to the unit 33, and the wire 31 is connected through pulleys 36 provided oppositely to the both ends of the plate 30 toward the lower portion of the plate 30 to a reciprocating air cylinder 37. The plate 30 is set previously at the low position to heat by the unit 33 to the prescribed temperature and the wire 31 is set to the plate 30. The wire 31 of the unit 40 of this structure is telescoped by the elevator 35 into the slots 32 to facilitate the heat treatment and reduce the size of the unit 40. |
