| 摘要 |
PURPOSE:To contrive improvement in reliability of the title semiconductor device by a method wherein a pattern is provided outside a pad part on an insulating film separated from the pad part and a resin layer is closely contacted without providing a cover film on a part of the surface of the insulating film, thereby preventing a leak current from flowing between pad parts. CONSTITUTION:The ring pattern 6 of a pad part is provided on the surface of an interlayer insulating film 2 surrounding a pad part 1a almost in u-shape as shown in the plane view diagram. A cover film 7 is not provided on the connecting part of bonding wires 3a and 3b and the center part 6' located along the longitudinal direction of the ring pattern 6 of the pad part. Accordingly, a resin layer 5 can be closely contacted directly to the part where the pattern located below is exposed. As the pattern 6 is tightly adhered to the resin layer 5 perfectly, no gap is generated between the pattern 6 and the resin layer 5, no moisture is intruded into said part, and no leak current is generated between the pad parts 1a and 1b. |
