| 摘要 |
PURPOSE:To implement a package having a high density, by arranging leads, which are provided on four sides, at the outer peripheral part of the lower surface of the package, and exposing the leads so that the lower surfaces thereof and the lower surface of the package form a flat plane. CONSTITUTION:A tab 4 is suspended at the approximately central part of a falt plastic package semiconductor 1 having a lead frame 2 by way of tab suspending leads 5 so that the tab is higher than an outer frame by a specified height. A pellet 8, in which an integrated circuit is formed, is bonded on the tab 4 by a suitable means. A plurality of electrode pads 9 are formed in a ring shape at the outer peripheral part of the pellet 8. The electrode pads 9 and bonding pads 7 on the leads 6 are connected with wires 10. Leads 6 are exposed so that the leads become flat at the outer peripheral part of the lower surface of the package. |
