发明名称 SURFACE TREATMENT OF COPPER
摘要 PURPOSE:To obtain economically a homogeneous Zn-Al alloy layer with no defect on the surface of copper by hot dipping by carrying out coating as surface preparation before the hot dipping. CONSTITUTION:A copper bar as a material to be hot dipped is immersed in a trichlene degreasing vessel, air-dried, dipped in concd. hydrochloric acid, and washed. The bar is further dipped in a flux treatment vessel contg. A ZnCl2+ NH4Cl soln. to stick the flux, and it is dried with hot air to remove water. The bar is then dipped in a molten Zn bath, and it is dipped in a molten Zn-Al alloy bath before solidifying the Zn underlayer or after solidifying it and carrying out pretreatment such as flux treatment again. Thus, the desired Zn-Al layer is obtd.
申请公布号 JPS59226164(A) 申请公布日期 1984.12.19
申请号 JP19830101973 申请日期 1983.06.08
申请人 HITACHI DENSEN KK 发明人 MIYAKE YASUHIKO;OONUKI MITSUAKI;ISHIDA AKINORI;OOSHIMA MASAO
分类号 C23C2/00;C23C2/02;C23C2/06;(IPC1-7):C23C1/02;C23C1/00 主分类号 C23C2/00
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