| 摘要 |
PURPOSE:To accelerate the measurement by a method wherein the electrodes of respective semiconductor circuit chips are connected to the electrodes of the other chips by a wiring formed on a scribe line to bring multiple probing needles into contact with the electrodes. CONSTITUTION:Within respective semiconductor circuit chips 4 on a semiconductor wafer 6, electrodes 2 impressed with the same voltage in case of testing electric characteristics are connected to one another by a wiring 3 formed on a scribe line 1. Multiple probing needles 5 fixed on a printed circuit board corresponding to a part of electrode pattern are brought into contact with a part of the electrodes 2 to test the electric characteristics of semiconductor circuit. At this time, the number of probing needles 5 per chip brought into contact with the electrodes 2 is reduced. Thus, the measurement can be accelerated.
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