| 摘要 |
PURPOSE:To separate easily each unit block, by coating a solder layer on the back surface of a wafer except back surface part in the vicinity of a scribing region, and scribing a wafer to manufacture a pallet. CONSTITUTION:A metal layer 2 providing solderbility is coated and formed on the back surface of a wafer 1 except the back surface part 5 in the vicinity of a scribing region. Recesses 6 are formed by half-dicing of the wafer in the scribe region. The wafer 1 is easily divided along the recesses 6 by breaking the wafer 1. A pellet 7 obtained after the scribing process mentioned above is joined in the ordinary manner to a pellet retaining substrate by soldering. As the result, each unit block is easily separated only by breaking after half- dicing of a wafer.
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