| 摘要 |
PURPOSE:To evaluate uniformity in the thickness of plated films during electroplating by applying voltage between electrically conductive patterns formed on an insulating subtrate and an electrode to carry out electroplating and by measuring electric currents generated in the patterns. CONSTITUTION:Voltage is applied between the pad terminals 8a-8d of an insulating substrate 6 and an electrode 12 from a power source 13 to carry out plating on electrically conductive patterns 7a-7d and the terminals 8a-8d. During the plating, electric currents Ia-Id generated in the patterns are measured with ammeters 14a-14d, and the thickness (t) of each deposited thin metallic film is calculated by the formula (where a is a constant depending on the kind of metal, I is electric current generated by applied voltage and S is plating area). Uniformity in the thickness of thin metallic films is evaluated according to the calculated thickness (t).
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