| 摘要 |
PURPOSE:The titled composition having improved adhesivity to polyamide resin and improved coating film physical properties such as luster, etc., obtained by blending a copolymer comprising an amide bond-containing vinyl monomer, etc., with a specific amount of polyisocyanate. CONSTITUTION:(A) A copolymer obtained by copolymerizing A1: 0.1-20wt%, preferably 1-10wt% amide bond-containing vinyl monomer[e.g. (meth) acrylamide, etc.] shown by formula (R1 and R2 are H or methyl; R3 is H, 1-12C alkyl, etc.) with A2: 1-60wt%, preferably 5-50wt% hydroxyl group-containing vinyl monomer [e.g. 2-hydroxyethyl (meth)acrylate, etc.] and A3: 20-98.9wt% vinyl monomer (e.g. styrene, etc.) copolymerizable with the component A1 and A2 is blended with (B) a polyisocyanate in an equivalent ratio ON/NCO =1/0.5-1/1.5.
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