| 摘要 |
PURPOSE:To surely sensitize the surface of an insulating material and to enable perfect electroless plating by making the surface of the insulating material hydrophilic, forming a copper colloid film on the surface and bringing the film into contact with an aqueous soln. contg. Pd ions. CONSTITUTION:The surface of an insulating material such as an epoxy resin substrate is made hydrophilic by a proper method and the material is immersed in an aqueous soln. of copper colloid to form a copper colloid film on the surface. The material is then immersed in an aqueous soln. contg. Pd ions (Pd<++>) in the form of palladium chloride or the like to deposit metal Pd on the surface of the copper colloid film. Thus, sensitization for electroless copper plating is carried out. When the sensitized epoxy resin substrate is subjected to electroless copper plating, the surface and the wall of a through hole in the substrate can be perfectly coated with a copper film. |
