| 摘要 |
PURPOSE:The titled composition, containing pyrogallol, a polyfunctional epoxy resin and curing agent, useful as a corrosion-resistant coating material for metal and capable of providing a resin-sealed semiconductor device operable with high reliability even if the device is left to stand at high temperatures and humidities for a long period. CONSTITUTION:A fire-retardant composition having large corrosion-inhibiting effect to metals and containing (A) pyrogallol and/or pyrogallol derivatives (e.g. pyrogallol-acetone resin) in an amount of preferably 0.1-30wt% based on total resin composition, (B) a polyfunctional epoxy compound and (C) a curing agent (e.g. phenol-formalin condensate). A resin-sealed semiconductor device is obtained by sealing and/or coating a semiconductor device with the resin composition.
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