| 摘要 |
<p>PURPOSE:To simplify a connecting process by a method wherein metal bumps built on a flip chip and ITO patterns are connected with each other by electroless metal plating. CONSTITUTION:Bumps 12 on a flip chip 11 are so positioned as to meet, respectively, their corresponding ITO patterns 14, and the flip chip 11 is bonded immovable to a circuit substrate 13 by an adhesive agent 15. The adhesive agent 15 should already be on the circuit substrate 13 or the flip chip 11 prior to the process. The bumps 12 or ITO patterns 14 should be clear of the adhesive agent 15, and the bumps 12 should be in close contact with the ITO patterns 14. The adhesive agent 15 should preferably be of an epoxy-based type capable of hardening at a room temperature. Next, following the hardening of the adhesive agent 15, the substrate 13 mounted with the flip-chip 11 is placed in an electroless plating liquid. In this process, the ITO patterns 14 and bumps 12 are coated with an Ni plate, which coating establishes electrical connection between the bumps 12 and ITO patterns 14.</p> |
