| 摘要 |
<p>PURPOSE:To detect semiconductor pellets without disordering the regular array of the pellets by projecting the lifted pellet, and detecting to pickup the image of the pellet. CONSTITUTION:A wafer ring 6 holds an adhesive sheet 5, diced semiconductor pellets 4, 4a, 4b are aligned on the sheet, and a post 7 for lifting the sheet 5 is provided under the sheet 5. A projection light source 3 and image sensing means 1, 2 are provided above the ring 6. An optical signal (an arrow 9) projected from the source 3 (an arrow 8), reflected by the pellet 4a (arrow 9a), and incident to an optical barrel 2 is converted to an electric signal. Thus, the sheet on which the diced pellet group are individually bonded is image-processed without influence to the pellets at the periphery without extending the sheet wholly to detect the coordinates data, profile of the pellet, and the presence or absence of improper ink.</p> |
