| 摘要 |
PURPOSE:To improve the bonding strength between the resin and the internal leads by fixing a semiconductor chip for insulation on the inner tip of a large number of common leads which are placed inward opposite to each other from both sides. CONSTITUTION:The structure of an internal lead frame is such that the end portion of internal leads 4 is extended to the reverse surface of a semiconductor chip 2. Thus, the chip can be positioned when packaged, eliminating the need for the chip mounting tab. In order to avoid the electrical contact between the semiconductor chip 2 and the internal leads 4, an insulating thin film 7, for instance, enamel or polyimide is inserted therebetween. With this, the bonding strength between the resin and the internal lead frame is enhanced, whereby the intrusion of moisture from the interface between the resin and the lead frame can be prevented.
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