| 摘要 |
<p>PURPOSE:To enable junctioning under low-temperature, low-load conditions by a method wherein a stage is given a horizontal oscillation with an inner lead on a film carrier kept pressed to a semiconductor pellet electrode by means of a junctioning tool. CONSTITUTION:A junctioning tool 8 comes down and presses an inner lead 7 to an electrode 1a of a semiconductor pellet 1, and then a predetermined signal is supplied by a controlling unit to motors 3 and 4 for their reciprocating movement of a prescribed quantity. The motor movement results in a horizontal oscillation of an XY table 5, that is, of a stage 2. The semiconductor pellet 1 goes into a horizontal oscillation together with the stage 2, when the inner lead 7 and electrode 1a rub each other for the acceleration of junctioning between the two. The motors 3 and 4 may be driven to create either X-direction or Y-direction oscillation. With the motors 3 and 4 serving as thc source of torque, the torque generated is strong enough to throw a relatively heavy specimen into oscillation. With the motors 3 and 4 being pulse motors, the stroke of oscillation may freely altered.</p> |
