| 摘要 |
PURPOSE:To realize uniform heating and thereby to stabilize products in their quality by a method wherein heater blocks at one or more positions for the assembly of semiconductor devices are of a non-contact type. CONSTITUTION:A circuit substrate 1 is supplied to a working position 24a, where it is subjected to preheating. An assembling device 51 capable of preheating is constituted of a stand 53 fixed to a bed 52, a heater support 54 installed thereon, and a non-contact type heater block 55 installed thereon, and is fixed, incapable of any vertical movement. The non-contact type heater block 55 is constituted of an upper surface that is a flat heating surface 56 and an infrared heating element 55a shaped like a flat box containing an infrared heat radiating unit within. Roughly uniform heating is accomplished by infrared energy radiated by the heating face 56. When the heating surface 56 is larger than the circuit substrate 1, with the heating surface 56 capable of heating the circuit substrate 1 noncontact, the circuit substrate 1 may he heated uniformly to a prescribed temperature irrespective of its geometry.
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