| 摘要 |
PURPOSE:To prevent reduction of the moisture resistance by making the position at which the width of the external leads becomes narrow remote from a plane including the bottom surface of the package for the external leads at or near both ends of the lead line, and near to the plane including the bottom surface of the package for the external leads near the center of the lead line. CONSTITUTION:The position at which the width of dual-in-line or DIL type external leads 2 becomes narrow is apart (distance t) from a plane including the bottom surface 3 of a package 1 for the external leads at or near both ends of the lead line, and near (distance t') to the plane including the bottom surface of the package. Therefore, when the external leads are inserted into the through-holes of a printed-circuit board, force is applied from the board only to the leads near both ends of the lead line, and the leads near the center of the lead line can avoid force being applied from the board, so that close contact with resin is little affected even if force is applied from the board. With this, there is no reduction of the moisture resistance even after the mounting into a printed-wiring board.
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