| 摘要 |
PURPOSE:To improve the bondability of a lead frame to a resin by extending inner leads onto a semiconductor chip, and interposing a thin insulating layer between the chips. CONSTITUTION:Electrodes 3 collected to the center of a chip 3 placed on a chip placing tab 1 are so sealed with resin 6 as to be electrically connected with inner leads 8 and fine metal wirings 5 arrived at the top of the chip through the chip 2 and an insulating thin layer 7. The layer 7 is bonded in advance to a lead frame, and bonded to the chip 2 by a bonding resin before electrically connected with the electrodes 3 on the chip on the tab lead 1. The layer 7 is so formed in space at the center as to connect the electrodes 3 with the lead frame. Thus, the bonding strength of the lead frame with the resin can be enhanced.
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