发明名称 Vapor phase processing system.
摘要 <p>A vessel contains a volume of solder (14) and a volume of electronic liquid (16) floats on the solder. A heater (18) heats the electronic liquid to generate a zone (20) of saturated vapor and to transfer heat to the solder across the interface therebetween. Hot saturated vapor is drawn downwardly through a manifold (48, 52) in the solder to heat the solder. Molten solder is applied to work product which is conveyed through the saturated vapor zone.</p>
申请公布号 EP0250150(A2) 申请公布日期 1987.12.23
申请号 EP19870305095 申请日期 1987.06.09
申请人 DYNAPERT-HTC CORPORATION 发明人 DERRICO, GERARD G.
分类号 B23K1/015 主分类号 B23K1/015
代理机构 代理人
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