| 摘要 |
PURPOSE:To prevent a phenomenon to concentrate the contraction stress of an epoxy resin in the interface direction producing a crack, and to improve the adhesion strength, by mixing a neddleform flat crystal substance to the epoxy resin which covers a lead wire and fixes it to a glass substrate. CONSTITUTION:An epoxy resin 8 mixed with a needle-form flat crystal substance 7 is used to fix a lead wire 3 soldered by a solder 5 at the end of an electrode 2, to the first glass substrate 1. As the neddle-form flat crystal substance 7, a ceramic resin, talc, Or mica, for example, is used, and its mixing ratio is determined adequately depending on the situation. Since the contraction stress of the epoxy resin 8 mixed with an adequate amount of needle-form flat crystal substance 7, produced in the solidification, is dispersed in the numerous directions by the function of the needle-form flat crystals 7 presenting at random, the stress distribution in the interface direction is avoided. Therefore, cracks around the lead wire connection S is prevented from production. |
