| 摘要 |
PURPOSE:To suppress generation of strain in a semiconductor chip itself, by sticking the semiconductor chip on a supporting board through bonding materials scattered on the supporting board like a sub-mount or a stem. CONSTITUTION:A semiconductor chip 1 is stuck through bonding materials 3 on the surface of a supporting board 2 like a sub-mount or a stem. The bonding materials 3 are disposed to be scattered on the supporting board 2 by means of mask or screen printing. Stress accompanying contraction when the bonding materials 3 being solidified, and the stress accompanying thermal expansion and contraction when the chip 1 being in operation are respectively dispersed in the bonding 2. Hence, generation of strain in the chip 1 itself can be suppressed.
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