| 摘要 |
PURPOSE:To prevent the mutual short circuit of bonding wires by forming a wiring lead region between a lead section and an island section. CONSTITUTION:A semiconductor integrated circuit device has bonding wires 1, 8, lead sections 2-4, a wiring lead section 5, bonding pads 6, an island section 7, a lead frame 9 and a semiconductor integrated circuit 10, and the wiring lead section 5 is shaped among the lead sections 2-4 and the island section 7. When bonding wires are each connected to the lead sections 2-4 from the bonding pads 6 in the semiconductor integrated circuit 10, the wires are connected to the lead section 3 from the bonding pad 6 in such a manner that the wire is connected to the wiring lead section 5 by the bonding wire 1 and the wire is connected to the lead section 3 from the wiring lead section 5 by employing the bonding wire 8. Accordingly, the possibility of the mutual short circuits of the bonding wires is reduced.
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