| 摘要 |
PURPOSE:To prevent the penetration of solder by melting by forming a multilayer metallic layer, using Al with no pin hole as a mask even in low- temperature evaporation. CONSTITUTION:When Al is employed as a mask material, Cu(l'') in a lower surface is etched by an ammonium persulfate aqueous solution, etc., using patterns o' and o'' slightly larger than an opening (p) acquired by laminating filmy resists on an upper surface and the lower surface and developing the filmy resists as masks, the filmy resists are peeled by employing acetone, etc., the filmy resists o''' are laminated again, and Cu(l') in the upper surface is etched by the ammonium persulfate aqueous solution, etc. Al (a) is etched by hydrochloric acid, etc., and the filmy resist o''' on the lower surface is peeled by employing acetone, etc., thus shaping multilayer metallic layers. A fine solder sphere is arranged to the Cu(l) section of the upper surface through the mask, and heated and melted, and cooled and fixed, thus forming a fundamental structure to which a solder bump is fastened.
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