| 摘要 |
PURPOSE:To improve the reliability of a thermal head by markedly reducing the number of nodes of bonding, by a method wherein two kinds of drive ICs, large and small, are mixed to be used. CONSTITUTION:Plural pieces of 1728 heating resistors 120 and of 28 pieces of drive ICs 130-1-130-13, 131-1, 132-1, 133-1-133-13 are arranged side by side between the common line for power source 110 and the common line for ground on a ceramic substrate 100. Then, a data input is carried out from a data input line 140, given to respective drive ICs 130-1-130-13, 131-1, 132-1, 133-1-133-13 serially and the last data is taken out from a data output line 180. The driver ICs to be selected by the enabling signal of respective enabling line 150-1, 150-2 are 13 pieces of 64 bit ICs 130-1-130-13 or 133-1-133-13 and one piece of 32 bit drive IC 131-1 or 132-1, and 64 bit drive IC and 32 bit drive ICs are mixed to be used. |
