BOITIER EN METAL ET RESINE POUR DISPOSITIF A SEMI-CONDUCTEUR, SUSCEPTIBLE D'ETRE FIXE SUR UN DISSIPATEUR NON PARFAITEMENT PLAN, ET SON PROCEDE DE FABRICATION

摘要

A semiconductor component package comprises a metal plate and a synthetic resin housing or body. The plate is formed with an aperture by which it can be secured to a heat sink, generally a metal plate. Around the aperture is a weakened annular portion produced by shearing. When the package housing is secured to a surface which is not completely flat, mechanical stressing due to the tightening of the screw coupling is limited to the weakened annular portion and is not transmitted to the resin housing and to the elements therein.