发明名称 DRYING METHOD FOR WAFER
摘要 PURPOSE:To enhance a moisture removing effect by inclining the wafer surface with respect to the rotor rotating surface at 2.5-30 deg. to spin dry it, thereby preventing the wafer from vibrating. CONSTITUTION:A spacer 21 is secured to the bottom of a carrier 2 in contact with a cradle stopper, a wafer is rotated while holding an angle theta with respect to a surface perpendicular to a rotational shaft 7 to dehydrate to dry it. A centrifugal force inclined with respect to the wafer surface is applied, the wafer is stably secured to a carrier groove to prevent it from vibrating. As a result, dust generation from the contact of the wafer with the carrier groove is reduced. Further, the air stream at the periphery of the wafer is stabilized to enhance the moisture removing effect of the wafer by the air stream.
申请公布号 JPS62291924(A) 申请公布日期 1987.12.18
申请号 JP19860134750 申请日期 1986.06.12
申请人 OKI ELECTRIC IND CO LTD;MIYAZAKI OKI ELECTRIC CO LTD 发明人 HIRANO YOSHIBUMI
分类号 F26B5/08;H01L21/304 主分类号 F26B5/08
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