| 摘要 |
PURPOSE:To shorten the whole length of a dipping processor for a semiconductor and to improve the operating efficiency of the processor by bringing an introducing position and a delivering position in coincidence. CONSTITUTION:When a carrier in which a wafer is input is disposed at an introducing and delivering unit, a sensor confirms an introducing carrier, and a robot 1 transport it to a carrier transporter 7 of clean atmosphere. It is passed through the transporter 7 under an air cleaner 6. and set at the designated position by means of an elevator 8. Then, the carrier is dipped in a processing tank 2 by the robot 1. The carrier is sequentially dipped, centrifugally dehydrated, dried and carried to a delivering unit. Since the introducing and delivering positions are disposed at the same position, the whole length of the processor can be shortened to seal it except the introducing and delivering ports, and it is exhausted out of a clean chamber, thereby remarkably reducing the occupying area in the clean chamber.
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