| 摘要 |
PURPOSE:To prevent the generation of defective plating and to prevent the wasteful consumption of electric power for plating by detecting the number of the materials to be plated entering a plating liquid cell and regulating the current of a plating power source according to the detected number at the time of carrying the many materials to be plated into the plating liquid and subjecting the same to electrolating. CONSTITUTION:Plural pieces of works R such as lead frames of semiconductor devices are mounted to the top ends 1b of jigs 1 as conveying means and are moved longitudinally by rollers 2 on a contact electrode 4 provided to the long edge 3a in the longitudinal direction of the plating cell 3. The works are conveyed in the plating liquid S and the anode 5 immersed in the plating liquid is energized as a cathode from the power source 12 by which the many works R are electroplated. The number of the works R is detected during the passage of the works between sensors 8a and 9b when the works enter the plating liquid cell. The number of the works R carried into the cell is inputted into a counter 10. The number of the works R counted in the counter is inputted to a macrocomputer 11 and the current value of the power source 12 is regulated by the output thereof. The change of the plating film thickness by the change of the number of the works is prevented and the wasteful consumption of the plating current when the number of the works R is small is prevented. |
