| 摘要 |
PURPOSE:To enable impurities to be fully washed off after a wafer being ground, by using either of glycosolve TM, Butyl carbitol, and 2 ethylhexyl acetate, as a paste agent for sticking a protective tape when the rear plane of the wafer being ground and as a washing liquid. CONSTITUTION:After a protective tape is sticked on the surface of a silicon wafer and the rear plane of the silicon wafer is ground, the protective tape is peeled to wash the silicon wafer. In such a method for washing the silicon wafer, either of glycosolve TM, Butyl carbitol, and 2-ethylhexyl acetate is used as a paste agent for sticking the protective tape and as a washing liquid. Glycosolve TM, and Butyl carbitol respectively mean commodity names, and essentially the former being triethylene glycol monomethyl ether and the latter being diethylene glycol monoalkyl ether. Preferrably, acryl emulsion paste with Butyl carbitol and interfacial active agent being added is used as the paste agent, and glycosolve TM is used as the washing liquid.
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