发明名称 WAFER CONVEYING MECHANISM
摘要 PURPOSE:To perform high speed conveyance with a simple device, by installing a carrier lock mechanism being rotated so as to cause each carrier to be opposed right to a conveying device, before conveying a wafer from plural carriers housing the wafer. CONSTITUTION:A wafer conveying mechanism 1 being set up adjacently to a wafer prober body 2 consists of both wafer carriers 3a and 3b, a pincette arm assembly 4 as a wafer conveying device and a handling arm 5. These carriers 3a and 3b are made up of mount blocks 6a and 6b having a hole 7 each, and they are moved up and down while rotated with shafts 31a and 31b as the center. The pincette arm assembly 4 mounts an arm 8 and a subchuck 9 and rotated with a shaft 41 as the center. A fact that the arm 8 is opposed right to these carries 3a and 3b is detected by a light emitting element 10, the hole 7 and a light receiving element 12, and the arm 8 goes forward and takes the wafer out or put back the wafer inspected by the prober 2. With this constitution, high speed processing takes place with a simple device.
申请公布号 JPS62290616(A) 申请公布日期 1987.12.17
申请号 JP19860131517 申请日期 1986.06.05
申请人 TOKYO ELECTRON LTD 发明人 ITOYAMA TAKETOSHI
分类号 H01L21/677;B65G1/00;B65G1/07;B65G47/90;H01L21/67;H01L21/68 主分类号 H01L21/677
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