| 摘要 |
PURPOSE:To improve thermal transfer efficiency to a heat sink fin by burying a flat platelike high heat conductive ceramic substrate in a package body of alumina ceramics, and providing the fin on the substrate at the opposite side to the mounting surface of a semiconductor chip through the hole opened at the body. CONSTITUTION:A high heat conductive ceramic substrate 23 which is incorporated in a package body 21 of alumina ceramics and on which a semiconductor chip is mounted is formed in a flat plate state to eliminate or minimize. Accordingly, beryllia which contains 95wt.% or more of beryllium oxide, a silicon carbide which contains 95wt.% or more of silicon carbide, is hard to be machined in a complicated shape and hot pressed though having high heat conductivity, or an AlN which contains 90wt.% of more of aluminum nitride can be used. Further, the substrate can be reduced in thickness, and thermal transfer efficiency to a heat sink fin 25 bonded to the surface opposite to the mounting surface of the substrate from a semiconductor chip 27 mounted on the substrate is improved. |
