| 摘要 |
PURPOSE:To form electronic circuits which has semiconductor chips on both side surfaces of an insulating substrate by containing the chips so wire bonded as to conceal the upper edges of wire loops in a deep recess region formed on both side surfaces of the substrate. CONSTITUTION:Semiconductor chips 4 are secured in the recess regions 2 of an insulating substrate 1, bonded by gold or aluminum wirings 5, the substrate 1 is overturned, chips 4 are similarly secured in the regions 2, and bonded by ordinary means. Then, to protect the chips 4 and the wirings 5, they are coated with protective resin films 6, capacitor elements 7 and resistance elements 8 are mounted, and secured with solders 9. Thus, semiconductor elements can be mounted by normal wire bonding technique on both side surfaces of the substrate. |
