| 摘要 |
PURPOSE:To easily fix substrates without contaminating the same and to efficiently cool the substrates by interposing a material which melts during the heating of the substrates and solidifies during the cooling thereof between the substrates and a substrate holder which can cool and heat the substrates, then executing ion milling. CONSTITUTION:A cooling water pipe 4 is disposed to the substrate holder 3 to be mounted with the substrates 1 of an ion milling device. A cooling water unit 6 and hot water unit 7 connected to said pipe are changed over by solenoid valves 5 so that the substrates 1 can be cooled and heated. The material such as adequately composed Ga-In alloy which melts during the heating of the substrates and solidifies during the cooling of the substrates is interposed as a tight contact material 2 between the substrates and the substrate holder 3. Hot water is then passed in the cooling water pipe 4 to heat and melt the material 2; thereafter, the cooling water is passed to the pipe to cool and solidify said material. The fixed substrates 1 are thereby efficiently cooled and the ion milling of the desired pattern is executed.
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