发明名称 BLOWN POLYAMIDE MOLDING
摘要 PURPOSE:To obtain a blown polyamide molding having transparency, heat resistance and gas barrier property, by forming a blown molding from a specified polyamide. CONSTITUTION:A blown molding formed from a polyamide formed by the polymerization or copolymerization of 75-100wt% component for forming a semi-aromatic polyamide (component a) comprising an aliphatic diamine and isophthalic acid and/or terephthalic acid with 25-0wt% component for forming an aliphatic polyamide (component B) comprising a lactam or both of an aliphatic diamine and an aliphatic dicarboxylic acid. The ratio of isophthalic acid to terephthalic acid used in component (a) is preferably 20:80-80:20 by weight. The polyamide used is usually produced by melt polymerization of a nylon salt comprising a diamine and a dicarboxylic acid or its aqueous solution, optionally, together with a lactom, or it is produced by a solution process or an interfacial polymerization process according to the composition of the isophthalic acid/terephthalic acid mixture.
申请公布号 JPS62290725(A) 申请公布日期 1987.12.17
申请号 JP19860135158 申请日期 1986.06.11
申请人 MITSUBISHI CHEM IND LTD 发明人 HASUO MASAYOSHI;URABE HIROSHI;KAWAI MICHIO
分类号 C08G69/26;C08G69/36 主分类号 C08G69/26
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