| 摘要 |
PURPOSE:To abolish measurement, in which errors are easily generated, and a complicate sorting process, and to supply chip elements under a continuous state as the difference of the values of capacitance is left as it is slight by taking out the chip elements in succession according to the order of the array of the chip elements and fitting the chip elements to electrode leads for an electrode member. CONSTITUTION:A band-shaped electrode member 1 is forwarded intermittently by a progressive device, and chip elements 3 isolated from the same silicon wafer 2 are placed and welded onto one electrode leads 4 on the electrode member 1 in succession. The chip elements are welded, and the other electrode leads 5 on the electrode member 1 and the chip elements 3 are wound as an electrode member 11 with the elements by a connection protective tape 12 by small-gage metal wires 6. The electrode member 11 is shifted to the next process, and the chip elements, the small-gage metal wires 6 and the leads 4, 5 are sealed in order where they are transferred by insulating coating bodies 7. The leads 4, 5 are cut in predetermined size, and isolated from the electrode member 11, nondefectives or defectives are decided, diodes 8 are completed, the order of an array is held as it is, and the diodes are maintained to a carrier tape 9 successively. The difference of the values of capacitance among the diodes 8 is reduced extremely.
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